At least 20 Companies Will Participate in Japan-TSMC Chip Development Project

The Japanese Government has engaged in a project with the Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest contract chipmaker, in an effort to develop cutting-edge chipmaking technologies in Japan.

Concerns surrounding the Japanese semiconductor industry’s declining position in the global market had been mounting in the Ministry of Economy, Trade, and Industry. This cooperation with TSMC hopes to ease this worry and restore Japan’s international competitiveness.

The cost of the project is estimated to cost around 37 billion yen ($337 million), half of which will be shouldered by TSMC. Partial funding will also come from the Japanese Government. At least 20 Japanese companies will be participating, including chip packaging firm Ibiden.

A trial facility is set to be constructed at the National Institute of Advanced Industrial Science and Technology in Tsukuba, Ibaraki Prefecture this summer at the earliest. Full-scale research and development work is eyed to begin by 2022.

TSMC also hopes to make more powerful chips, and cooperating with Japanese companies known for their strengths in materials and manufacturing equipment is a good stepping stone.

Coming up with so-called 3D packaging technology for semiconductors is among TSMC’s plans. This makes the participation of Ibiden, a global leader in packaging technology, ideal.

Other participating firms include: Asahi Kasei, a materials maker known for its ultrathin wiring; Shin-Etsu Chemical, which makes a new heat-dissipating material; Nagase & Co., a molding materials specialist; and Shibaura Mechatronics, a manufacturing equipment producer.

Source: Nikkei Asia